Symposium FB
Materials Issues in Flexible and Stretchable Electronics for Device Reliability and Performance

John A. ROGERS, University of Illinois, USA
W. Hong YEO, Georgia Institute of Technology, USA

Tricia Breen CARMICHAEL, University of Windsor, Canada
Vladimir DYAKONOV, Julius-Maximilian University, Germany
Guglielmo FORTUNATO, CNR-IMM, Italy
Martin HEENEY, Imperial College London, UK
Yonggang HUANG, Northwestern University, USA
Olle INGANAS, Linkoping University, Sweden
Jae-Woong JEONG, KAIST, South Korea
Martin KALTENBRUNNER, Johannes-Kepler University Linz, Austria
Dae-Hyeong KIM, Seoul National University, South Korea
Taek-Soo KIM, KAIST, South Korea
Virgilio MATTOLI, Istituto Italiano di Tecnologia, Italy
Ivan MINEV, Technical University Dresden, Germany
Michele MUCCINI, CNR-ISMN, Italy
Christian MUELLER, Chalmers University of Technology, Sweden
Arokia NATHAN, Cambridge Touch Technologies, UK
Yong-Young NOH, Pohang University of Science and Technology, South Korea
Tsuyoshi SEKITANI, Osaka University, Japan
Xing SHENG, Tshinghua University, China
Takao SOMEYA, University of Tokyo, Japan
Ye TAO, National Research Council Canada, Canada
Manos M. TENTZERIS, Georgia Institute of Technology, USA
Shizuo TOKITO, Yamagata University, Japan
Luisa TORSI, University of Bari, Italy
Jacek ULANSKI, Lodz University of Technology, Poland
Junliang YANG, Central South University, China
Yang YANG, University of California, Los Angeles, USA
Gleb YUSHIN, Georgia Institute of Technology, USA
Ana Claudia ARIAS, University of California at Berkeley, USA
Mario CAIRONI, Istituto Italiano di Tecnologia, Italy
Wenlong CHENG, Monash University, Australia
Kenjiro FUKUDA, RIKEN, Japan
Jesse JUR, North Carolina State University, USA
Martin KALTENBRUNNER, Johannes-Kepler University Linz, Austria
Dae-Hyeong KIM, Seoul National University, South Korea
Yong-Young NOH, Pohang University of Science and Technology, South Korea
Qibing PEI, University of California at Los Angeles, USA
Oliver SCHMIDT, IFW Dresden, Germany
Felice TORRISI, Imperial College London, UK
Junliang YANG, Central South University, China
Flexible and stretchable electronics is empowering unprecedented approaches to ubiquitous electronics: owing to its mechanical compliance, it offers opportunities for many new applications in energy transformation and storage, deformable displays, wearable electronic systems, memory devices, compliant large area electronics and in bioelectronics.
Major challenges for research is to achieve both excellent long-term reliable mechanical soundness and electronic performance, joined with compatibility with living tissues and low-toxicity when biomedical applications are involved. The intrinsic mechanical properties of molecular and polymeric organic semiconductors in principle render them ideal candidates for a range of flexible and conformable devices. Nevertheless, when very high performing active electronic components are required, inorganic materials and novel nanomaterials may be the preferred options, demanding alternative device architectures to accommodate for the respective mechanical properties.
This symposium aims at presenting timely research in materials, their mechanics, designs, modelling, novel phenomena and techniques enabling the fabrication of flexible, stretchable and ultra-conformable electronics for the diverse fields of ongoing or potential applications, with special focus on demand on materials and prospective solutions.
Session Topics

FB-1 Materials and fabrication processes

  • Emerging Organic, Inorganic and Hybrid active device materials (conductors, semiconductors, dielectrics)
  • Functional electronic inks for flexible and stretchable electronics
  • Advanced growing, printing and patterning technologies for flexible and stretchable electronics
  • Nonplanar fabrication processes
  • Substrates and encapsulating/barrier materials and methods

FB-2 Device physics, mechanics and design

  • Charge injection, transport and generation phenomena in materials for flexible/stretchable electronics
  • Design of highly stretchable/deformable and conformable electronics
  • Mechanics of thin film deposited on (or embedded in) plastic substrates
  • Biomechanics of soft biological tissue/device interfaces
  • Mechanical, thermal and electronic modelling of flexible/stretchable hybrid electronic systems and components

FB-3 Applications of flexible/stretchable electronics

  • Electronics and optoelectronics: flexible/stretchable thin film transistors, bendable/stretchable/conformable electronic circuits, sensors, light emitting diodes
  • Flexible energy conversion/storage: solar cells, thermoelectric generators, fuel cells, batteries, supercapacitors, energy harvesters
  • Biomedical: conformable neural interfaces, implantable soft devices, bioMEMS, prosthetic skin
  • Transducers: e-textiles, wearable electronics, cyber-skin, flexible MEMS, microsensors, microactuators, etc
  • Bio-inspired systems in organic electronics for biotechnology and medical applications


Cimtec 2020

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